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Center for Optoelectronics and Optical Communications
College of Science

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    • M.S. in Optical Science and Engineering
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Services

  • Facilities
    • Grigg Hall
  • Capabilities
  • Equipment
    • 01 Lithography
      • The Raith 150 E-beam Lithography System
      • Quintel Mask Alignment System
      • Laurell Spin Processor
      • Brewer Science Spin Processor
      • Brewer Science Hot Plate
      • GCA 5X Stepper
    • 02 Material Deposition and Etching
      • Rapid Thermal Process System
      • AJA Sputtering Tool
      • AJA Ion Mill System
      • III-V ICP Compound Semiconductor Etch System
      • AOE Dielectric Etch System
      • ASE ICP Deep Silicon Etch System
      • PECVD (Plasma Enhanced Chemical Vapor Deposition)
      • Lesker Evaporator
    • 03 Packaging
      • Dicing Saw MicroAutomation
      • Flip Chip Bonder
      • Scribe and Break Tool
      • Wire Bonder K&S
      • Digital Wedge Bonding System
    • 04 Imaging and Characterization
      • X-Ray Diffraction (XRD)
      • JEOL SEM w/EDAX
      • Veeco NanoScope IV SPM Controller
      • VASE Research Spectroscopic Ellipsometer
      • Olympus Microscope MX51
      • Olympus Microscope OLS4000
      • Raith SEM
    • 05 Metrology
      • Fisba Interferometer
      • Veeco Inferometer
      • Zygo Inferometer
    • 06 Networking and Fiber Optics
      • Fusion Splicer-Ericsson
      • Fusion Splicer-Fujikura FSM 20PM
      • Fusion Splicer-Fujikura FSM 40S
      • Optical Fiber Polishing Machine
      • Ultrapol Fiber Lensing System
      • Optical Backscatter Reflectometer
      • Optical Vector Analyzer
      • NanoRobot Alignment System
      • Optical Time Domain Reflectometer
      • All Parameter Test Station
      • Movaz DWDM
      • Norland Connect-Chek 6000
      • RIFOCS Component Test System
      • Seiko Fiber Polisher
      • Westover Video Fiber Microscope
    • 07 Laser Facility
      • Continuum Nd YAG Laser
      • Continuum Panther Oscillator
      • Continuum Minilite II Nd YAG Laser
      • Spectra-Physics Tsunami
    • 08 Biologics Characterization
      • Circular Dichroism J-1500 Spectrometer
  • Forms & Documents
  • Rates List

03 Packaging

  • Dicing Saw MicroAutomation
  • Flip Chip Bonder
  • Scribe and Break Tool
  • Wire Bonder K&S
  • Digital Wedge Bonding System K&S
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